PI China's First Attendance of CSPT Proved To Be Fruitful
In November 2022, for the first time, PI China attended the 20th China Semiconductor Packaging and Test Technology & Market Annual Conference (CSPT 2022) at the Nantong International Convention and Exhibition Center in the Jiangsu Province.
The conference addresses more than 200 industry leaders in the semiconductor packaging and test technology industries, and incorporates more than seven hours of summit forum keynote speeches, six thematic technical forums, and an online audience of more than 42,000 participants.
PI China's first attendance of the CSPT proved to be fruitful. The topics for discussion range from the development of semiconductor packaging and testing products to industry trends, a market outlook, advanced packaging design, and process designs.
Chris Hong, Head of Country – China, held a speech called ‘Solutions to Move Mo(o)re’ about the application of PI’s technology in the semiconductor sector.
This covered everything from ‘PI’s technologies in backend applications’ to ‘potential new technology insertions’, as well as ‘from components to engineering systems’, covering hexapod technology and Fast Multi-Channel Photonics Alignment (FMPA) systems, magnetic drive technology, bending actuators, and piezo components. The speech attracted a lot of attention both online and offline, and was highly praised by customers in the semiconductor industry.
The Chinese government is strongly promoting the development of the semiconductor industry.
Many government leaders attended the CSPT, and spoke at the conference, sincerely urging entrepreneurs to innovate and expand their businesses, collaboratively implementing national strategies on integrated circuits (IC) industry development, and contributing to the growth of the global IC industry.
Contact person: Chris Hong, Head of Country – China
